Scenario: A semiconductor fab deploys deep learning anomaly detection on plasma etch chambers. Each chamber has 47 sensors (gas flows, pressures, RF power, temperatures, optical emission spectra) sampled at 10 Hz during 3-minute etch processes.
Given: - Training data: 45,000 normal etch processes (no defective wafers) over 8 months - Input shape per process: 1,800 timesteps x 47 features = 84,600 values - Anomaly definition: Process that produces defective wafer (known from downstream metrology) - Historical defect rate: 0.3% of processes - Deployment: NVIDIA Jetson AGX Xavier (32GB RAM, 512 CUDA cores) - Requirement: Process-level decision within 10 seconds of etch completion
Steps: 1. Feature engineering for temporal data: - Segment each process into 6 phases (30s each): gas stabilization, plasma ignition, main etch (3 phases), purge - Extract per-phase statistics: mean, std, min, max, slope for each sensor (47 x 5 x 6 = 1,410 features) - Dimensionality: 84,600 raw values compressed to 1,410 phase-aggregated features
- Autoencoder architecture design:
- Encoder: 1410 -> 512 -> 256 -> 64 (bottleneck)
- Decoder: 64 -> 256 -> 512 -> 1410
- Activation: ReLU (hidden), linear (output)
- Total parameters: 1.8 million (7.2 MB float32)
- Training configuration:
- Loss function: MSE reconstruction loss
- Optimizer: Adam, learning rate 1e-4 with cosine decay
- Batch size: 128 processes
- Training epochs: 150 (early stopping at epoch 112)
- Training time: 2.4 hours on 4x V100 GPUs
- Validation reconstruction error (normal): mean 0.023, std 0.008
- Threshold determination:
- Compute reconstruction error on 5,000 validation processes (all normal)
- Set threshold at 99.5th percentile: 0.047 (3 sigma above mean)
- Test on 200 known-defective processes: 178 exceed threshold (89% recall)
- Test on 5,000 normal processes: 24 exceed threshold (0.48% false positive rate)
- Deployment optimization for Jetson:
- Convert to TensorRT: 2.1x inference speedup
- Mixed precision (FP16): Model size 3.6 MB, inference time 82ms
- Batch inference: 10 processes in parallel, 340ms total
Result: TensorRT-optimized autoencoder achieves 89% recall on defective processes with 0.48% false positive rate. End-to-end latency is 3.2 seconds (feature extraction) + 0.34s (inference) = 3.5 seconds per process. Over 6-month deployment, the system flagged 156 processes; 141 were true defects (90.4% precision), preventing $2.1M in downstream processing of defective wafers. 15 false alarms cost ~$45K in additional metrology.
Key Insight: For high-dimensional time-series anomaly detection, phase-based feature aggregation dramatically reduces autoencoder input size while preserving discriminative information. A 60x dimensionality reduction (84,600 to 1,410) enables faster training, smaller models, and more robust generalization. The key is domain knowledge - knowing that plasma etch has distinct phases allows meaningful aggregation rather than arbitrary windowing.